Development of dicing technique for thin semiconductor substrates with femtosecond laser ablation

Atsushi Yokotani; Toru Mukumoto; Toshio Mizuno; Kou Kurosawa; Kosuke Kawahara; Takafumi Ninomiya; Hiroshi Sawada

doi:10.1117/12.531677

15 July 2004 Development of dicing technique for thin semiconductor substrates with femtosecond laser ablation

Atsushi Yokotani, Toru Mukumoto, Toshio Mizuno, Kou Kurosawa, Kosuke Kawahara, Takafumi Ninomiya, Hiroshi Sawada

Proceedings Volume 5339, Photon Processing in Microelectronics and Photonics III; (2004) https://doi.org/10.1117/12.531677
Event: Lasers and Applications in Science and Engineering, 2004, San Jose, Ca, United States

Abstract

We have analyzed the drilling process with femtosecond laser on the silicon surface in order to investigate a degree of thermal effect during the dicing process of the very thin silicon substrate (thickness: 50 μm). Femtosecond laser pulse (E = 30~500 μJ/pulse, τ = 150~200 fs, λ = 780nm, f = 10 Hz) was focused on the silicon substrate using a lens with a focal length of 100 mm. An image-intensified CCD camera with a high-speed gate of 5 ns was utilized to take images of drilled hole during the processing. As a result, the rise time for increasing diameter of the holes was changed at energy between 180 and 350 μJ/pulse. The width of the molten walls around the hole became wider under the conditions where the rise time became longer. So, it is said that we can estimate the degree of the thermal effect qualitatively by analyzing the rise time. These knowledge is thought to be very important and useful for developing the dicing technique of thin silicon wafers by femtosecond lasers.

Citation Download Citation

Atsushi Yokotani, Toru Mukumoto, Toshio Mizuno, Kou Kurosawa, Kosuke Kawahara, Takafumi Ninomiya, and Hiroshi Sawada "Development of dicing technique for thin semiconductor substrates with femtosecond laser ablation", Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); https://doi.org/10.1117/12.531677

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available