Hybrid micro-patch lasers with high alignment tolerance

Byoung Jun Park; Yushin Kim; Moohyuk Kim; Myung-Ki Kim

doi:10.1117/12.2633273

3 October 2022 Hybrid micro-patch lasers with high alignment tolerance

Byoung Jun Park, Yushin Kim, Moohyuk Kim, Myung-Ki Kim

Author Affiliations +

Proceedings Volume PC12196, Active Photonic Platforms 2022; PC121961V (2022) https://doi.org/10.1117/12.2633273
Event: SPIE Nanoscience + Engineering, 2022, San Diego, California, United States

Conference Poster

Abstract

Recently several attempts by using transfer printing method for integration of on-chip laser into silicon circuit. These approaches can minimize wasted III-V areas but has the disadvantage of requiring high alignment tolerances. Here, we propose a new concept of hybrid silicon laser, which is high tolerable in alignment. Employing the whispering gallery mode laser in conjunction with III-V patch layer, designed hybrid micro-patch laser has high design flexibility, and lower the process difficulty in fabrication. We expect the hybrid micro-patch laser to be the next generation device of on-chip micro-lasers.

Citation Download Citation

Byoung Jun Park, Yushin Kim, Moohyuk Kim, and Myung-Ki Kim "Hybrid micro-patch lasers with high alignment tolerance", Proc. SPIE PC12196, Active Photonic Platforms 2022, PC121961V (3 October 2022); https://doi.org/10.1117/12.2633273

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