Paper
19 September 1995 MEMS infrastructure: the multiuser MEMS processes (MUMPs)
Karen W. Markus, David A. Koester, Allen Cowen, Ramu Mahadevan, Vijayakumar R. Dhuler, D. Roberson, L. Smith
Author Affiliations +
Proceedings Volume 2639, Micromachining and Microfabrication Process Technology; (1995) https://doi.org/10.1117/12.221300
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States
Abstract
In order to help provide access to advanced MEMS technologies, and lower the barriers for both industry and academia, MCNC, and ARPA have developed a program which works to provide users with access to both MEMS processes and advanced integration techniques. The two distinct aspects of this program, the MUMPs and Smart MEMS, will be described in this paper. The multi-user MEMS processes (MUMPs) is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. MUMPs is a proof-of-concept and educational tool to aid the developemnt of MEMS in the domestic community. MUMPs technologies currently include a 3-layer polysilicon surface micromachining process and LIGA processes that provide reasonable design flexibility within set guidelines. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Karen W. Markus, David A. Koester, Allen Cowen, Ramu Mahadevan, Vijayakumar R. Dhuler, D. Roberson, and L. Smith "MEMS infrastructure: the multiuser MEMS processes (MUMPs)", Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, (19 September 1995); https://doi.org/10.1117/12.221300
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Cited by 33 scholarly publications.
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KEYWORDS
Microelectromechanical systems

Silicon

Electronics

Metals

Oxides

Polysomnography

Sensors

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