The concept of combining the Laser MicroJet(R) (LMJ) water jet-guided laser with a standard industrial diamond blade saw was first proposed early in 2006. The idea has now been taken a step forward with a joint project between Synova SA and Disco Hi-Tech Europe GmbH. The hybrid machine being developed integrates an LMJ module in place of the second blade saw on a Disco dual-spindle machine. The resulting machine will be fully capable of sequencing the different processes to carry out dicing of complex and layered semiconductors wafer, in any possible combination. It will be possible to program both processes to run independently in parallel or allow sequential operation during the same cutting pass. This extraordinary flexibility, combined with the speed advantages, quality of material cutting and simplification in processing in a fully automatic mode for up to 300 mm wafers, all now available in a single machine,
will greatly benefit the manufacturing community. This paper will provide some insight into the design and operation of the hybrid machine and some examples of the improvements gained from its use.
High-brightness LEDs are compound semiconductor devices and distinguish themselves from conventional LEDs by
their exceptional luminosity. Today they are increasingly used as light sources, replacing conventional incandescent and
fluorescent lamp technologies. HB LEDs are difficult to manufacture, as they must be grown by sophisticated epitaxial
growth techniques such as MOCVD. They are packaged like power semiconductors, using surface mount technology and
thermal pads.
After having been successfully applied to GaN scribing for side-emitting LEDs, the Laser MicroJet(R) is used today for
cutting heat sinks of HB white LEDs. Due to the high-emitted light power, the generated heat must be dissipated through
a heat sink. Materials typically employed are metals with high heat conductivity, notably CuW and molybdenum.
Applying the Laser MicroJet(R) the achieved cutting quality in these metals is outstanding - smooth edges, no
contamination, no burrs, no heat damage, no warping - all this at high speed.
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