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Bin Wu
at Univ of Shanghai for Science and Technology
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Author
Publications (1)
Proceedings Article | 18 November 2008 Paper
Packaging and thermal characteristics of Epi-down bonded uncooled pump lasers
Proceedings Volume 7135, 71353A (2008) https://doi.org/10.1117/12.802942
KEYWORDS: Laser bonding, Resistance, Fiber Bragg gratings, Fiber lasers, Finite element methods, Packaging, Thermography, Optical simulations, Heatsinks, Fiber coupled lasers
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