KEYWORDS: Image enhancement, Image processing, Algorithm development, Video processing, Color and brightness control algorithms, Infrared imaging, Detection and tracking algorithms, Electronics, Imaging systems, Video
The MWIR imaging systems developed by L-3 Communications Cincinnati Electronics (L-3 CE) include several video processing algorithms designed to provide enhanced imagery that meets a variety of military and other application requirements. When IR imaging systems are confronted with varying IR conditions, video processing algorithms are designed and selected to optimize human interpretation of specific scene details. The Visual Difference Predictor model has been used and a derived Image Enhancement Score has been developed to provide an objective metric to evaluate the effects of processing algorithms on imagery. Comparing the Image Enhancement Score of the processed image gives an objective measure of the success of the video processing algorithm being evaluated. This paper will describe selected algorithms in the L-3 CE Video Processing Suite, evaluate them against several test scenes and present associated Image Enhancement Scores. These will include a novel local contrast enhancement, general sharpening, and display mapping algorithms. Finally, the direction of ongoing and future efforts in Video Processing Suite development will be discussed.
CMC Electronics Cincinnati (CMC) is now in production on 1Kx1K InSb focal plane arrays (FPAs), and continuing efforts on a third production run of 2Kx2K large format IR FPAs. These FPAs are based on our unique reticulated InSb architecture that has been shown to be inherently scalable across format size while maintaining performance properties. Performance in the 10mk to 15mk NETD range will be shown. The design and fabrication of these advanced FPAs has challenged the state of the art in fabrication processing, testing, and qualification of both InSb detectors and silicon ROICs. Program sponsored manufacturing improvement activities, as well as CMC internal R&D, continue to improve both the yields and the performance characteristics of these large arrays. The latest yield, operability, and performance data will be shown. Data will be drawn from a population of approximately 30 2Kx2K FPAs and 50 1Kx1K FPAs. A novel approach to rapid thermal cycling FPAs will we described and recent developments that enable the fabrication of reticulated, smaller pixel pitch devices and practical Ultra Large Format FPAs with additional capability and features will be discussed.
Last year, CMC reported performance data on the first article large format Indium Antimonide (InSb) Focal Plane Arrays (FPAs) produced at CMC Electronics Cincinnati (CMCEC). CMCEC's FPA design contains novel, thermally matched elements, which allow scaling from 256 x 256 pixel FPAs up to and including 1Kx1K and 2Kx2K FPAs as shown in Figure 1. Since a common process and wafer size is used to fabricate 256 x 256 640 x 512, 1Kx1K and 2Kx2K FPAs, the main issue in providing 2Kx2K FPAs is one of yeild improvement, not invention. Approximately 30 of these large format 1Kx1K and 2Kx2K FPAs have been built and 18 have been integrated into deliverable systems over the last year.
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