Extreme Ultraviolet Lithography (EUVL) is the next step for optical lithography moving toward shorter wavelengths. EUVL is a leading technology for device fabrication with feature sizes of 70 nm and below, and is being developed in the U.S., Japan and Europe. The implementation of EUV requires new technologies in sources, optics and resists materials, different from those of the more traditional optical techniques. The course introduces EUVL and the status of developments in the US and worldwide. It focuses on practical issues associated with the design and use of an EUVL stepper. The instructors address the details of the materials and optics, discuss the image formation process, the resist properties, mask design and fabrication, and the current design of lithographic tools.