Many advanced applications require high throughput, high removal rate processing of silicon and polysilicon materials with very low surface roughness. This presentation will focus on the latest consumable sets for processing silicon and polysilicon to achieve high removal rate and very low surface roughness. We will present the polishing results using double sided polishing tools from different consumables showing the effects of changing slurries, pads and cleaning chemistry on polishing results. This presentation present data on current generation and next generation consumables to show how the optimization of new slurries and pads can achieve high removal rate and very low surface roughness.
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