Proceedings Article | 31 March 2006
KEYWORDS: Packaging, Microelectromechanical systems, Semiconducting wafers, Ceramics, Silicon, Integrated circuits, Wafer bonding, Sensors, Microsystems, Semiconductors
Electronic packaging is traditionally defined as the back-end process that transforms bare integrated circuits (IC) into
functional products. As the IC feature size decreases and the size of silicon wafer increases, the cost per IC is reduced
and the performance is enhanced. The future IC chips will be larger in size, have more input/output terminals (I/Os), and
require higher power. In addition to the advancements in IC technology, electronic packaging is also driven by the
market requirements for low cost, small size, and multi-functional electronic products. In response to these requirements,
packaging related areas such as design, packaging architectures, materials, processes, and manufacturing equipment are
all changing rapidly. Wafer-level packaging (WLP) offers the benefits of low cost and smallest size for single chip
packages, since the package is done at wafer level other than individual die. After packages reach the horizontal limit of
dimensions, 3D stacking solution provides more efficient packages through expanding packages in the vertical
dimension. Functional integration is achieved with 3D stacking architectures. System in package (SiP), one of the
solutions to system integration, incorporates electronics, non-electronic devices such as optical devices, biological
devices, micro-electro-mechanical systems (MEMS), etc, and interconnection in a single package, to form smart
structures or microsystems. MEMS devices require specialized packaging to serve new market applications. This paper
and presentation describe the technology requirements and challenges of these advancing packaging areas. The potential
solutions and future trends are presented.
