Ms. Jiao Zhang Profile

Jiao Zhang

at Shanghai Huali Microelectronics Corp

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 23 March 2020 Paper

CMP simulation-based dummy fill optimization

Liwei Jiang, Yun Cao, Jiao Zhang, Fang Wei, Zhengfang Liu, Chunshan Du, Ruben Ghulghazaryan, Davit Piliposyan, Jeff Wilson, Qijian Wan, Xinyi Hu, Zhixi Chen

Proceedings Volume 11328, 1132817 (2020) https://doi.org/10.1117/12.2551681

KEYWORDS: Chemical mechanical planarization, Manufacturing, Optimization (mathematics), Copper, Design for manufacturing, Lithography, Modeling and simulation, Product engineering, Semiconducting wafers, Model-based design

Read Abstract +

Chemical-mechanical polishing (CMP) is a key process in integrated circuit (IC) manufacturing. Successful fabrication of semiconductor devices is highly dependent on the final planarity of the processed layers. Post-CMP topography variation may cause degradation of the circuit performance. Moreover, the depth-of-focus (DOF) requirement is critical for lithography of subsequent layers. As such, planarity requirements are critical for maintaining IC manufacturing technology scaling trends, and supporting device innovation. To mitigate post-CMP planarity issues, dummy fill insertion has become a commonly-used technique. Many factors impact dummy fill insertion results, including fill shapes, sizes, and the spacing between both fill shapes and the drawn layout patterns. The goal of the CMP engineer is to optimize design planarity, but the variety of fill options means just verifying the design rules for fill is a challenging task. This data collection currently requires a long development cycle, consuming a great deal of time and resources. In this paper, we show how CMP modeling can help resolve these issues by applying CMP modeling and simulations to drive Calibre YieldEnhancer SmartFill parameters that have been optimized for dummy fill. Additional capabilities in the SmartFill functionality automate CMP hotspot fixing steps. Using CMP simulations, engineers can get feedback about post-CMP planarity for given fill options in a much shorter time. Not only does this move dummy fill optimization experiments from a real lab into a virtual lab of CMP modeling and simulation, but it also provides more time for these experiments, providing improved results.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years