The exponential growth in data center traffic which creates a need for a paradigm shift in I/O technology that meets future connectivity requirements within data centers. Silicon Photonics (SiPh) based optical interfaces significantly improve I/O density by optimizing solutions along three technology vectors independently: Packaging density, speed per lane, and number of wavelengths per channel.
This paper shows the necessary technologies for a SiPh based optical I/O solution that merges mature silicon chiplet packaging and fiber connectivity to achieve the highest I/O efficiency for networking applications. An early Broadcom prototype system is demonstrated.
The exponential growth in data center traffic is driving an increase in demand for cost and energy efficient interface bandwidth scaling. This creates a need for a paradigm shift in I/O technology that meets future connectivity requirements within data centers. Silicon Photonics (SiPh) based optical interfaces significantly improve I/O density by optimizing solutions along three vectors: Packaging density, speed per lane, and number of wavelengths per channel. Each vector must be independently optimized. This paper recommends a SiPh based optical I/O platform that merges mature silicon chiplet packaging and fiber connectivity to achieve the highest I/O efficiency for networking applications.
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