Lasers used in optical interconnects in data centers require electro-absorption modulators (EAMs) with low energy consumption and cost. In this study, we designed and optimized EAM through numerical simulation. By optimizing the doping concentration in the separate confinement heterostructure (SCH) layer, we achieved an increase in the maximum extinction ratio (ER) from 44 dBm to 64 dBm and a reduction in the driving voltage from 3.8 V to 2.9 V. These results provide theoretical support for further reducing the energy consumption and cost of EAM in optical communication, especially in the current era of escalating data volume.
Distributed Feedback (DFB) semiconductor lasers with low Relative Intensity Noise (RIN) are in demand for high-power and narrow-linewidth applications. However, there is a lack of research on the compatibility of these features, together with RIN degradation at high temperature. In this paper, the RIN characteristics of InGaAsP multi-quantum-well DFB lasers are studied through theoretical calculation and numerical investigation, the results of which are very close. Based on numerical simulation, the epitaxy layers and optical cavity structures of DFB lasers are optimized to improve the RIN performance. The simulation results show that a high-power laser with an output power up to 400 mW and a narrow-linewidth laser with a linewidth below 300 kHz can obtain a peak RIN below -166 dB/Hz and -160 dB/Hz from 0.1 to 20 GHz, respectively, meeting the requirements of light sources for microwave photonics system and coherent optical transceiver system. In terms of thermal effect, buried heterostructure lasers could effectively mitigate the deterioration of RIN compared to ridge waveguide lasers due to better temperature characteristics.
For constructing functional photonic integrated circuits, it is expected to incorporate an efficient and compact laser source into the complementary metal-oxide-semiconductor platform. Monolithic integration of III-V submicron lasers on patterned SOI substrates by means of the aspect ratio trapping method is a promising solution. Here, we have designed submicron lasers with reversed ridge waveguides on patterned Si/SOI substrates by three dimensional finite difference time domain simulation, effectively confining the light into the submicron lasers without removing the top Si layer. The reversed ridge waveguide structure can be formed by extending the III-V materials out of the SiO2 trench. The high-quality InP reversed ridge waveguide epitaxial structures have been obtained. The results of the simulations show that the optical leakage loss is reduced to the order of 10-2. This provides a new approach to develop the silicon-based submicron lasers emitting at the telecom bands.
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