Electrochemical etching of III-nitride-materials is a fast-developing research field. This method is used to selectively porosify or completely etch such materials and thereby opens up a new design space for both photonic and electronic devices. Here we will focus on complete lateral electrochemical etching for substrate removal to realise thin-film vertical-cavity surface-emitting lasers (VCSELs) and light emitting diodes (LEDs). Key challenges that will be addressed are how to achieve etched surfaces as smooth as the as-grown material and how to protect fully processed and highly doped device structures such as tunnel junctions, during substrate removal.
We will give an overview of state-of-the-art results and challenges to achieve high-performing III-nitride vertical-cavity surface-emitting lasers (VCSELs), with a particular focus on the requirements to push the emission wavelength into the ultraviolet (UV). Our method to simultaneously achieve high-reflectivity mirrors and good cavity length control by electrochemical etching enabled the world’s first UV-B VCSEL. The use of dielectric mirrors yielded lasers with a very temperature-stable emission wavelength thanks to the negative thermo-optic coefficient of the mirrors. We have used the same etch methodology to also lift-off fully processed LEDs from their growth substrate to improve the light extraction efficiency.
We will give an overview of different concepts to increase the light extraction efficiency (LEE) of ultraviolet (UV) light-emitting diodes (LEDs) with a focus on thin-film flip-chip (TFFC) devices. Optical simulations show that a TFFC design can greatly improve the LEE with a transparent p-side, reflective contacts, and optimized surface roughening. We will demonstrate UVB-emitting TFFC LEDs based on our fabrication platform for AlGaN thin films with high aluminum content. The fabrication is compatible with a standard LED process and uses substrate removal based on selective electrochemical etching as the key enabling technology.
In recent years, there has been tremendous improvement in the performance of blue-emitting vertical-cavity surface-emitting lasers (VCSELs) and they are now on the cusp of commercialization. We will summarize state-of-the-art results and outline the main challenges in extending the emission wavelength into the ultraviolet (UV). Our method to simultaneously achieve high-reflectivity mirrors and good cavity length control by selective electrochemical etching has been essential to demonstrate the world’s first UV-B VCSEL. The use of dielectric mirrors, where one material has a negative thermo-optical coefficient, counteracts the inherent red-shift of the resonance wavelength, enabling a temperature-stable emission.
We here demonstrate thin-film flip-chip (TFFC) ultraviolet-B light-emitting diodes (LEDs) fabricated by a standard LED process and followed by a substrate removal based on selective electrochemical etching of an n-doped multilayered Al0.11Ga0.89N/Al0.37Ga0.63N sacrificial layer. The integration of the LEDs to a Si carrier using thermocompression bonding allowed roughening of the N-polar AlGaN side of the TFFC LEDs using TMAH-etching, which increased the light extraction efficiency by approximately 45% without negatively affecting the I-V-characteristics. This resulted in an optical output power of 0.47 mW at 10 mA for an LED with a p-contact area of 0.03 mm2.
We will give an overview of the progress in ultraviolet-emitting vertical-cavity surface-emitting lasers (VCSELs) and their potential applications in areas such as disinfection and medical therapy. This includes our demonstration of the shortest wavelength VCSEL, emitting at 310 nm under optical pumping, and a detailed analysis of its filamentary lasing characteristics. The UVB-emitting AlGaN-based VCSEL was realized by substrate removal using electrochemical etching, enabling the use of two high-reflectivity dielectric distributed Bragg reflectors. The potential of using this or alternative methods to push the emission to shorter wavelengths will be examined as well as concepts to realize electrically injected devices.
III-nitride membranes offer novel device designs in photonics, electronics and optomechanics. However, substrate removal often leads to a rough back surface, which degrades device performance. Here, we demonstrate GaN membranes with atomically smooth etched surfaces by electrochemical lift-off, through the implementation of a built-in polarization field in the sacrificial layer. This leads to a faster reduction in the sacrificial layer free carrier density during etching and thus an abrupter etch stop, reducing the root-mean-square roughness down to 0.4 nm over 5×5 µm2. These results open interesting perspectives on high-quality optical cavities and waveguides in the ultraviolet and visible.
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