Nano and micro-structure electrode gaps were fabricated by an electroforming method. Thin film materials were
fabricated on an insulator substrate and the microelectrodes with desired shapes were fabricated. Then the electroformation
was carried out to produce the gap structure. Controllability of the size of these gaps was investigated by
modeling and experimental method. It was found that the nanostructure of wide range of metal, metal oxides and
compound semiconductors can be fabricated by this method. In this study, we have attempted formation of Al and Au.
Simulation study was carried out based on finite element analysis (FEA) technique. The simulation results were verified
with the experimental data.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.