Ms. Yixiao Wang Profile

Yixiao Wang

Rearch Assistant at Leibniz Univ Hanover

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Publications (2)

Proceedings Article | 13 May 2016 Paper

Optical coupling of bare optoelectronic components and flexographically printed polymer waveguides in planar optronic systems

Yixiao Wang, Tim Wolfer, Alex Lange, Ludger Overmeyer

Proceedings Volume 9891, 989103 (2016) https://doi.org/10.1117/12.2227340

KEYWORDS: Polymers, Polymer multimode waveguides, Semiconductor lasers, Polymeric sensors, Waveguides, Polymer multimode waveguides, Optoelectronics, Optical simulations, Optical alignment, Printing, Polymethylmethacrylate

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Large scale, planar optronic systems allowing spatially distributed functionalities can be well used in diverse sensor networks, such as for monitoring the environment by measuring various physical quantities in medicine or aeronautics. In these systems, mechanically flexible and optically transparent polymeric foils, e.g. polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET), are employed as carrier materials. A benefit of using these materials is their low cost. The optical interconnections from light sources to light transmission structures in planar optronic systems occupy a pivotal position for the sensing functions. As light sources, we employ the optoelectronic components, such as edgeemitting laser diodes, in form of bare chips, since their extremely small structures facilitate a high integration compactness and ensure sufficient system flexibility. Flexographically printed polymer optical waveguides are deployed as light guiding structures for short-distance communication in planar optronic systems. Printing processes are utilized for this generation of waveguides to achieve a cost-efficient large scale and high-throughput production. In order to attain a high-functional optronic system for sensing applications, one of the most essential prerequisites is the high coupling efficiency between the light sources and the waveguides. Therefore, in this work, we focus on the multimode polymer waveguide with a parabolic cross-section and investigate its optical coupling with the bare laser diode. We establish the geometrical model of the alignment based on the previous works on the optodic bonding of bare laser diodes and the fabrication process of polymer waveguides with consideration of various parameters, such as the beam profile of the laser diode, the employed polymer properties of the waveguides as well as the carrier substrates etc. Accordingly, the optical coupling of the bare laser diodes and the polymer waveguides was simulated. Additionally, we demonstrate optical links by adopting the aforementioned processes used for defining the simulation. We verify the feasibility of the developed processes for planar optronic systems by using an active alignment and conduct discussions for further improvements of optical alignment.

Proceedings Article | 27 February 2015 Paper

Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems

Yixiao Wang, Meriem Akin, Lisa Jogschies, Ludger Overmeyer, Lutz Rissing

Proceedings Volume 9366, 936609 (2015) https://doi.org/10.1117/12.2077072

KEYWORDS: Polymers, Adhesives, Polymer thin films, Ultraviolet radiation, Polymethylmethacrylate, Optoelectronic devices, Positron emission tomography, Polymer thick film flex circuits, Sputter deposition, Independent component analysis

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In the field of modern information technology, optoelectronics are being widely used, and play an increasingly important role. Meanwhile, the demand for more flexible circuit carriers is rapidly growing, since flexibility facilitates the realization of diverse functions and applications. As a potential candidate, transparent polymer substrates with a thickness of about a hundred micrometers by virtue of their low cost and sufficient flexibility are getting more attention. Thus, accomplishing an integration of optoelectronic components into polymer based flexible circuit systems increasingly is becoming an attractive research topic, which is of great significance for future information transmission and processing. We are committed to developing a new microchip bonding process to realize it. Taking into account the fact that most economical transparent polymer substrates can only be processed with restricted thermal loading, we designed a so-called optode instead of a widely adopted thermode. We employ UV-curing adhesives as bonding materials; accordingly, the optode is equipped with a UV irradiation source. An investigation of commercial optoelectronic components is conducted, in which their dimensions and structures are studied. While selecting appropriate transparent polymer substrates, we take their characteristics such as UV transmission degree, glass transition temperature, etc. as key criterions, and choose polyethylene terephthalate (PET) and polymethyl methacrylate (PMMA) as carrier materials. Besides bonding achieved through the use of adhesives cured by the optode, underfill is accordingly employed to enhance the reliability of the integration. We deposit electrical interconnects onto the polymeric substrate to be able to bring the optoelectronic components into electrical operation. In order to enlarge the optical coupling zone from component to substrate within the proximity of the adhesive or underfill, we employ transparent interconnects made of indium-tin-oxide. We present the results of the performance tests, including the contact resistances, mechanical tests and environmental tests.

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