A novel wafer baking system using hot air streams

Lan Wang; Siew Loong Chow; Ai Poh Loh; Zhi Ming Gong; Woei Wan Tan; Arthur E. B. Tay; Weng Khuen Ho

doi:10.1117/12.534753

14 May 2004 A novel wafer baking system using hot air streams

Lan Wang, Siew Loong Chow, Ai Poh Loh, Zhi Ming Gong, Woei Wan Tan, Arthur E. B. Tay, Weng Khuen Ho

Proceedings Volume 5376, Advances in Resist Technology and Processing XXI; (2004) https://doi.org/10.1117/12.534753
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

This paper presents a novel wafer baking system that uses hot air streams as heating media and achieves good temperature uniformity across the entire wafer surfaces during the baking process. Wind tunnel experiments have been carried out to verify the concept of using hot air streams for wafer baking. A simple prototyping wafer baking system has been designed and fabricated, and experiments of the baking process have been conducted. Good temperature uniformity across the wafer surface has been achieved. The experimental results match well with the computer fluid dynamics (CFD) simulation results. It is observed that the velocity of the airflow has significant influence on the temperature transient responses. Further optimization of the parameters of the baking system and analytical modelling studies are currently under way.

Citation Download Citation

Lan Wang, Siew Loong Chow, Ai Poh Loh, Zhi Ming Gong, Woei Wan Tan, Arthur E. B. Tay, and Weng Khuen Ho "A novel wafer baking system using hot air streams", Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); https://doi.org/10.1117/12.534753

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