Mr. Venkat R. Nagaswami Profile

Venkat R. Nagaswami

Director at KLA Corp

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Author

Publications (12)

Proceedings Article | 19 March 2015 Paper

Defect mitigation and root cause studies in IMEC's 14nm half-pitch chemo-epitaxy DSA flow

Hari Pathangi, Boon Teik Chan, Hareen Bayana, Nadia Vandenbroeck, Dieter Van Den Heuvel, Lieve Van Look, Paulina Rincon-Delgadillo, Yi Cao, JiHoon Kim, Guanyang Lin, Doni Parnell, Kathleen Nafus, Ryota Harukawa, Ito Chikashi, Venkat Nagaswami, Lucia D'Urzo, Roel Gronheid, Paul Nealey

Proceedings Volume 9423, 94230M (2015) https://doi.org/10.1117/12.2085889

KEYWORDS: Etching, Silicon, Bridges, Scanning electron microscopy, Inspection, Diffractive optical elements, Semiconducting wafers, Thin film coatings, Defect inspection, Directed self assembly

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Proceedings Article | 2 April 2014 Paper

Spectroscopic critical dimension technology (SCD) for directed self assembly

Senichi Nishibe, Thaddeus Dziura, Venkat Nagaswami, Roel Gronheid

Proceedings Volume 9050, 90502U (2014) https://doi.org/10.1117/12.2046647

KEYWORDS: Single crystal X-ray diffraction, Semiconducting wafers, Critical dimension metrology, Scanning electron microscopy, Etching, Directed self assembly, Scatterometry, Silicon, Inspection, Polymethylmethacrylate

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Proceedings Article | 2 April 2014 Paper

Defect analysis methodology for contact hole grapho epitaxy DSA

Ryota Harukawa, Masami Aoki, Andrew Cross, Venkat Nagaswami, Shinichiro Kawakami, Takashi Yamauchi, Tadatoshi Tomita, Seiji Nagahara, Makoto Muramatsu, Takahiro Kitano

Proceedings Volume 9050, 905027 (2014) https://doi.org/10.1117/12.2046051

KEYWORDS: Inspection, Wafer-level optics, Scanning electron microscopy, Wafer inspection, Defect detection, Semiconducting wafers, Optical lithography, Epitaxy, Defect inspection, Directed self assembly

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Proceedings Article | 28 March 2014 Paper

Inspection of directed self-assembly defects

Chikashi Ito, Stephane Durant, Steve Lange, Ryota Harukawa, Takemasa Miyagi, Venkat Nagaswami, Paulina Rincon Delgadillo, Roel Gronheid, Paul Nealey

Proceedings Volume 9049, 90492D (2014) https://doi.org/10.1117/12.2046634

KEYWORDS: Inspection, Signal to noise ratio, Etching, Semiconducting wafers, Silicon, Wafer inspection, Defect inspection, Line edge roughness, Wafer-level optics, Directed self assembly

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Proceedings Article | 28 March 2014 Paper

Defect reduction and defect stability in IMEC's 14nm half-pitch chemo-epitaxy DSA flow

Roel Gronheid, Paulina Rincon Delgadillo, Hari Pathangi, Dieter Van den Heuvel, Doni Parnell, Boon Teik Chan, Yu-Tsung Lee, Lieve Van Look, Yi Cao, YoungJun Her, Guanyang Lin, Ryota Harukawa, Venkat Nagaswami, Lucia D'Urzo, Mark Somervell, Paul Nealey

Proceedings Volume 9049, 904905 (2014) https://doi.org/10.1117/12.2047265

KEYWORDS: Etching, Inspection, Silicon, Semiconducting wafers, Scanning electron microscopy, Defect inspection, Polymethylmethacrylate, Particles, Critical dimension metrology, Directed self assembly

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SPIE Journal Paper | 20 August 2013

Defect source analysis of directed self-assembly process

Paulina Delgadillo, Mayur Suri, Stephane Durant, Andrew Cross, Venkat Nagaswami, Dieter Van den Heuvel, Roel Gronheid, Paul Nealey

JM3, Vol. 12, Issue 03, 031112, (August 2013) https://doi.org/10.1117/12.10.1117/1.JMM.12.3.031112

KEYWORDS: Inspection, Etching, Semiconducting wafers, Critical dimension metrology, Particles, Chemical analysis, Scanning electron microscopy, Polymethylmethacrylate, Signal processing, Directed self assembly

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Proceedings Article | 18 April 2013 Paper

DSA hole defectivity analysis using advanced optical inspection tool

Ryota Harukawa, Masami Aoki, Andrew Cross, Venkat Nagaswami, Tadatoshi Tomita, Seiji Nagahara, Makoto Muramatsu, Shinichiro Kawakami, Hitoshi Kosugi, Benjamen Rathsack, Takahiro Kitano, Jason Sweis, Ali Mokhberi

Proceedings Volume 8681, 86811A (2013) https://doi.org/10.1117/12.2011177

KEYWORDS: Inspection, Semiconducting wafers, Wafer inspection, Reticles, Wafer-level optics, Epitaxy, Optical inspection, Defect inspection, Optical lithography, Directed self assembly

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Proceedings Article | 26 March 2013 Paper

Defect source analysis of directed self-assembly process (DSA of DSA)

Paulina Rincon Delgadillo, Ryota Harukawa, Mayur Suri, Stephane Durant, Andrew Cross, Venkat Nagaswami, Dieter Van Den Heuvel, Roel Gronheid, Paul Nealey

Proceedings Volume 8680, 86800L (2013) https://doi.org/10.1117/12.2011674

KEYWORDS: Semiconducting wafers, Etching, Inspection, Critical dimension metrology, Particles, Scanning electron microscopy, Plasma etching, Polymethylmethacrylate, Thin film coatings, Directed self assembly

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Proceedings Article | 20 April 2011 Paper

Impact of pellicle on overlay in double patterning lithography

Oliver Loeffler, Frank Laske, Michael Ferber, Klaus-Dieter Roeth, Lin Chua, You Seung Jin, Gino Marcuccilli, Venkat Nagaswami

Proceedings Volume 7971, 79712D (2011) https://doi.org/10.1117/12.879905

KEYWORDS: Pellicles, Photomasks, Reticles, Personal protective equipment, Double patterning technology, Lithography, Distortion, Image registration, Adhesives, Error analysis

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Proceedings Article | 29 March 2011 Paper

Mask registration impact on intrafield on-wafer overlay performance

Guo-Tsai Huang, Alex Chen, Tung-Yaw Kang, S. C. Lee, Frank Laske, Klaus-Dieter Roethe, DongSub Choi, Chiang Reinhart, John Robinson, You Seung Jin, Lin Chua, David Tien, Venkat Nagaswami

Proceedings Volume 7971, 797106 (2011) https://doi.org/10.1117/12.879485

KEYWORDS: Photomasks, Semiconducting wafers, Overlay metrology, Scanners, Image registration, Error analysis, Optical lithography, Lithography, Double patterning technology, Reticles

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Proceedings Article | 2 April 2010 Paper

Automated optimized overlay sampling for high-order processing in double patterning lithography

Chiew-seng Koay, Matthew Colburn, Pavel Izikson, John Robinson, Cindy Kato, Hiroyuki Kurita, Venkat Nagaswami

Proceedings Volume 7638, 76381R (2010) https://doi.org/10.1117/12.846371

KEYWORDS: Semiconducting wafers, Statistical modeling, Lithography, Overlay metrology, Double patterning technology, Photomasks, Optical lithography, Metrology, Data modeling, Mathematical modeling

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Proceedings Article | 8 June 1998 Paper

Specific defect density: a new approach for defect reduction

Venkat Nagaswami, Jos van Gessel, Dries van Wezep

Proceedings Volume 3332, (1998) https://doi.org/10.1117/12.308740

KEYWORDS: Etching, Semiconducting wafers, Process control, Metrology, Inspection, Defect detection, Particles, Optical lithography, Overlay metrology, Oxides

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Showing 5 of 12 publications

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