Dr. Yi Zhou Profile

Dr. Yi Zhou

at Yangtze Memory Technologies Co Ltd

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 22 February 2021 Poster + Presentation + Paper

A novel method of overlay variation study for 3D NAND channel hole

Leeming Tu, Haydn Zhou, Erik Xiao, Jin Zhu, Cynthia Li, Ningqi Zhu, Xin Li, Jason Pei, Miao Bing, Seddy Chu, Kevin Huang, Bob Dong

Proceedings Volume 11611, 116112W (2021) https://doi.org/10.1117/12.2583760

KEYWORDS: Etching, Statistical analysis, Semiconducting wafers, Overlay metrology, Process control, Photomasks, Optical alignment, Opacity, Metrology, Feedback control

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Proceedings Article | 20 March 2020 Presentation + Paper

3D-NAND wafer process monitoring using high voltage SEM with auto e-beam tilt technology

Leeming Tu, Jian Mi, Henry Fan, Haydn Zhou, Felix Xiong, Louis Tu, Gangyi Chen, Chuanyu Shao, Long Zhang, Shinji Kubo

Proceedings Volume 11325, 113250L (2020) https://doi.org/10.1117/12.2551610

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Scanning electron microscopy, Overlay metrology, Sensors, Signal detection, 3D metrology, Etching, Electron beams, Electron microscopes

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Proceedings Article | 20 March 2020 Paper

VIA dishing metrology for novel 3D NAND using neural network assisted white light interferometry

Sicong Wang, Xiaoye Ding, Yi Zhou, Yanzhong Ma, Le Yang, Chi Chen, Lu Chen

Proceedings Volume 11325, 113250B (2020) https://doi.org/10.1117/12.2550947

KEYWORDS: Metrology, Atomic force microscopy, Neural networks, Image processing, Semiconducting wafers, 3D metrology, Optical interferometry

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Proceedings Article | 20 March 2020 Presentation + Paper

Machine learning and hybrid metrology using HV-SEM and optical methods to monitor channel hole tilting in-line for 3D NAND wafer production

Michael Meng, Leeming Tu, Jian Mi, Haydn Zhou, Xi Zou

Proceedings Volume 11325, 113250O (2020) https://doi.org/10.1117/12.2551622

KEYWORDS: Semiconducting wafers, Machine learning, Wafer-level optics, 3D metrology, Metrology, Channel projecting optics, Optical metrology, Principal component analysis, Scanning electron microscopy, Etching

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