CONFERENCE PROCEEDINGS
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Hyunjun Kim
at SK Hynix Inc
SPIE Involvement:
Author
Publications (4)
Proceedings Article | 27 April 2023 Poster + Paper
Residuals reduction in imaging-based overlay using color per layer
Shlomit Katz, Suk Won Park, Joonsang You, Hyunjun Kim, Honggoo Lee, Jungchan Kim, Dongyoung Lee, Hongbok Yeon, Joonseuk Lee, Sang-Ho Lee, Jae Wook Seo, Dor Yehuda, Junho Kim, Hongcheon Yang, Dohwa Lee, Nanglyeom Oh, Dongsub Choi, Wayne Zhou, Hedvi Spielberg, Ohad Bachar
Proceedings Volume 12496, 1249626 (2023) https://doi.org/10.1117/12.2655681
KEYWORDS: Metrology, Overlay metrology, High volume manufacturing, Optical parametric oscillators, Optical gratings, Visualization
Proceedings Article | 26 May 2022 Poster + Presentation + Paper
Advanced CD uniformity correction using radial basis function (RBF) models
Philip Groeger, Ulrich Denker, Robin Zech, Stefan Buhl, Matthias Ruhm, Mingyu Kim, Hongseok Jang, Chunsoo Kang, Dongyoung Lee, Hyunjun Kim, Sukwon Park, Bohye Kim, Honggoo Lee, Sangho Lee, Dongsub Choi, Jeonghoon Lee
Proceedings Volume 12053, 1205314 (2022) https://doi.org/10.1117/12.2607571
KEYWORDS: Semiconducting wafers, Data modeling, Scanners, Critical dimension metrology, Performance modeling, Mathematical modeling, Etching, Error analysis, Algorithm development, Zernike polynomials, Modeling, Modeling and simulation
Proceedings Article | 26 May 2022 Presentation + Paper
Overlay stability control in IBO measurement using rAIM target
Proceedings Volume 12053, 120530E (2022) https://doi.org/10.1117/12.2608053
KEYWORDS: Overlay metrology, Process control, Optical lithography, Metrology, Inspection, Semiconducting wafers, Data modeling, Wafer-level optics, Optical properties, Optical design
Proceedings Article | 26 May 2022 Poster + Paper
Spectral analysis overlay measurement approach for improvement of overlay accuracy in advanced integrated circuits
Proceedings Volume 12053, 120531Z (2022) https://doi.org/10.1117/12.2613981
KEYWORDS: Semiconducting wafers, Overlay metrology, Process control, Integrated circuits, Wafer-level optics, Scanners, Principal component analysis, Manufacturing, Inspection, Accuracy assessment
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