Mr. Takuya Kono Profile

Takuya Kono

Senior Manager at KIOXIA Corp

SPIE Involvement:

Author

Publications (32)

Proceedings Article | 10 April 2024 Presentation

Preliminary qualification of 3D nanoimprint process for dual damascene wiring.

Masaki Mitsuyasu, Norikazu Takeuchi, Masanori Hirose, Shunsuke Honda, Akihiko Ando, Toshiaki Komukai, Motofumi Komori, Takuya Kono

Proceedings Volume PC12956, PC129560G (2024) https://doi.org/10.1117/12.3010093

KEYWORDS: Nanoimprint lithography, Overlay metrology, Optical lithography, Line edge roughness, High volume manufacturing, Etching, Yield improvement, Sustainable technology, Semiconductors, Semiconducting wafers

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Proceedings Article | 1 May 2023 Presentation + Paper

Fabrication of dual damascene structure with nanoimprint lithography and dry-etching

Norikazu Takeuchi, Genna Hasegawa, Toshiaki Komukai, Takahiro Iwasaki, Masayuki Hatano, Motofumi Komori, Takuya Kono

Proceedings Volume 12497, 124970E (2023) https://doi.org/10.1117/12.2657912

KEYWORDS: Silica, Photoresist processing, Electron beam lithography, Resistance, Semiconducting wafers, Fabrication, Optical lithography, Lithography

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Proceedings Article | 13 June 2022 Presentation

Evaluation of alignment accuracy for nano-imprint lithography

Kazuya Fukuhara, Masaki Mitsuyasu, Ryo Ogawa, Katsuya Abe, Anupam Mitra, Sachiko Kobayashi, Satoshi Mitsugi, Motofumi Komori, Takuya Kono

Proceedings Volume PC12054, PC120540B (2022) https://doi.org/10.1117/12.2614407

KEYWORDS: Optical alignment, Semiconducting wafers, Nanoimprint lithography, Lithography, Semiconductor manufacturing, Semiconductors, Overlay metrology, Optical simulations, Manufacturing, Wafer-level optics

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Proceedings Article | 26 May 2022 Presentation + Paper

Design process integration enabling the productivity enhancement for nanoimprint lithography

Sachiko Kobayashi, Satoshi Mitsugi, Katsuyoshi Kodera, Kazuya Fukuhara, Anupam Mitra, Koki Ueha, Katsuya Abe, Motofumi Komori, Shingo Kanamitsu, Takuya Kono

Proceedings Volume 12052, 1205208 (2022) https://doi.org/10.1117/12.2614319

KEYWORDS: Nanoimprint lithography, Semiconducting wafers, Optical alignment, Optical lithography, Scanning electron microscopy, Ultraviolet radiation, Lithography, Scanning transmission electron microscopy

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SPIE Journal Paper | 4 March 2022

Improvement of productivity by spin-coating and flash imprint lithography

Takahiro Iwasaki, Hirokazu Miyoshi, Anupam Mitra, Masayuki Hatano, Kazuya Fukuhara, Motofumi Komori, Takuya Kono, Tetsuro Nakasugi

JM3, Vol. 21, Issue 01, 011008, (March 2022) https://doi.org/10.1117/12.10.1117/1.JMM.21.1.011008

KEYWORDS: Nanoimprint lithography, Semiconducting wafers, Lithography, Head, Photoresist processing, Coating, System on a chip, Overlay metrology, Capillaries, Ultraviolet radiation

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SPIE Journal Paper | 24 January 2022

Advanced underlayer film to enhance the productivity of nanoimprint lithography

Kasumi Okabe, Takeshi Higuchi, Motofumi Komori, Takuya Kono

JM3, Vol. 21, Issue 01, 011006, (January 2022) https://doi.org/10.1117/12.10.1117/1.JMM.21.1.011006

KEYWORDS: Nanoimprint lithography, Gases, Semiconducting wafers, Polymers, Helium, Diffusion, Photomasks, Photoresist processing, Hydrogen, Extreme ultraviolet lithography

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Proceedings Article | 22 February 2021 Presentation

Improvement of productivity by spin coating nanoimprint lithography

Takahiro Iwasaki, Hirokazu Miyoshi, Mitra Anupam, Masayuki Hatano, Motofumi Komori, Takuya Kono

Proceedings Volume 11610, 116100A (2021) https://doi.org/10.1117/12.2583676

KEYWORDS: Nanoimprint lithography, Semiconducting wafers, Photoresist processing, Lithography, Semiconductors, Diffusion, Coating, Capillaries

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Proceedings Article | 26 March 2019 Paper

Half-pitch 14nm direct patterning with nanoimprint lithography

Takuya Kono, Masayuki Hatano, Hiroshi Tokue, Hirokazu Kato, Kazuya Fukuhara, Tetsuro Nakasugi

Proceedings Volume 10958, 109580H (2019) https://doi.org/10.1117/12.2514685

KEYWORDS: Nanoimprint lithography, Optical lithography, Semiconducting wafers, Image processing, Distortion, Overlay metrology, Photoresist processing, Lithography, Particles, Photomasks

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Proceedings Article | 2 May 2018 Presentation + Paper

Improvement of nano-imprint lithography performance for device fabrication

Takuya Kono, Masayuki Hatano, Hiroshi Tokue, Kei Kobayashi, Hirokazu Kato, Masato Suzuki, Kazuya Fukuhara, Tetsuro Nakasugi, Eun Hyuk Choi, Wooyung Jung

Proceedings Volume 10584, 105840V (2018) https://doi.org/10.1117/12.2297294

KEYWORDS: Nanoimprint lithography, Semiconducting wafers, Optical alignment, Overlay metrology, Distortion, Particles, Optical lithography, Photoresist processing, Lithography, Extreme ultraviolet lithography

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Proceedings Article | 23 March 2018 Paper

Process control technology for nanoimprint lithography

Hirotaka Tsuda, Hirokazu Washida, Motofumi Komori, Takuya Kono, Tetsuro Nakasugi, Wooyung Jung

Proceedings Volume 10584, 105841D (2018) https://doi.org/10.1117/12.2297332

KEYWORDS: Nanoimprint lithography, Process control, Lithography, Photoresist processing, Nanotechnology, Manufacturing, Critical dimension metrology, Photomasks, Line edge roughness, Etching

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Proceedings Article | 21 March 2018 Paper

Material development for high-throughput nanoimprint lithography

Kei Kobayashi, Takayuki Nakamura, Hirokazu Kato, Masayuki Hatano, Hiroshi Tokue, Tetsuro Nakasugi, Eun Hyuk Choi, Wooyung Jung, Takuya Kono

Proceedings Volume 10584, 105841F (2018) https://doi.org/10.1117/12.2297307

KEYWORDS: Nanoimprint lithography, Photoresist processing, Optical lithography, Image processing, Ultraviolet radiation, Diffusion, Interfaces, Lithography, Liquids, Etching

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Proceedings Article | 19 March 2018 Presentation + Paper

Design for nanoimprint lithography: hot spot modification through total NIL process simulation

Sachiko Kobayashi, Kyoji Yamashita, Hirotaka Tsuda, Kazuhiro Washida, Motofumi Komori, Ji-Young Im, Takuya Kono, Tetsuro Nakasugi

Proceedings Volume 10584, 105840R (2018) https://doi.org/10.1117/12.2297361

KEYWORDS: Nanoimprint lithography, Optical lithography, Lithography, Photoresist processing, Design for manufacturing, High volume manufacturing, Process modeling, Source mask optimization, Optical proximity correction

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Proceedings Article | 3 April 2017 Paper

Overlay control for nanoimprint lithography

Kazuya Fukuhara, Masato Suzuki, Masaki Mitsuyasu, Takuya Kono, Tetsuro Nakasugi, Yonghyun Lim, Wooyung Jung

Proceedings Volume 10144, 1014409 (2017) https://doi.org/10.1117/12.2256715

KEYWORDS: Nanoimprint lithography, Overlay metrology, Optical alignment, Lithography, Semiconducting wafers, Distortion, Process control, Error analysis, Silicon, Semiconductor manufacturing

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Proceedings Article | 31 March 2017 Paper

RLT uniformity improvement utilizing multi-scale NIL process simulation

Sachiko Kobayashi, Ryoichi Inanami, Hirotaka Tsuda, Kazuhiro Washida, Motofumi Komori, Kyoji Yamashita, Ji-Young Im, Takuya Kono, Shimon Maeda

Proceedings Volume 10144, 101440X (2017) https://doi.org/10.1117/12.2258172

KEYWORDS: Nanoimprint lithography, Photoresist processing, Design for manufacturability, Nanolithography, Optical lithography, Ultraviolet radiation, Scatter measurement, UV optics, Lithography, Double patterning technology, Design for manufacturing, Optical microscopes, Nanotechnology, Artificial intelligence

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Proceedings Article | 21 March 2017 Presentation + Paper

Study of nanoimprint lithography (NIL) for HVM of memory devices

Takuya Kono, Masayuki Hatano, Hiroshi Tokue, Kei Kobayashi, Masato Suzuki, Kazuya Fukuhara, Masafumi Asano, Tetsuro Nakasugi, Eun Hyuk Choi, Wooyung Jung

Proceedings Volume 10144, 1014406 (2017) https://doi.org/10.1117/12.2257951

KEYWORDS: Nanoimprint lithography, Overlay metrology, Lithography, Line edge roughness, Semiconductors, Critical dimension metrology, Nanotechnology, Semiconducting wafers, Optical lithography, Particles, Distortion, Optical alignment, Inspection

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Proceedings Article | 21 March 2017 Paper

The opportunity and challenge of spin coat based nanoimprint lithography

Wooyung Jung, Jungbin Cho, Eunhyuk Choi, Yonghyun Lim, Cheolkyu Bok, Masatoshi Tsuji, Kei Kobayashi, Takuya Kono, Tetsuro Nakasugi

Proceedings Volume 10144, 1014412 (2017) https://doi.org/10.1117/12.2257845

KEYWORDS: Particles, Semiconducting wafers, Nanoimprint lithography, Coating, Optical lithography, Logic, Manufacturing, Defect inspection, High volume manufacturing, Lithography, Ultraviolet radiation, Photoresist processing

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Proceedings Article | 22 March 2016 Paper

NIL defect performance toward high volume mass production

Masayuki Hatano, Kei Kobayashi, Hiroyuki Kashiwagi, Hiroshi Tokue, Takuya Kono, Nakasugi Tetsuro, Eun Hyuk Choi, Wooyung Jung

Proceedings Volume 9777, 97770B (2016) https://doi.org/10.1117/12.2218972

KEYWORDS: Defect detection, Process control, Nanoimprint lithography, Lithography, Line edge roughness, Semiconductors, Critical dimension metrology, Silicon, Semiconducting wafers, Industrial chemicals, Contamination, Chemical analysis, Photoresist processing, Extreme ultraviolet lithography, Photomasks, Image processing

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Proceedings Article | 22 March 2016 Paper

Design for nanoimprint lithography: total layout refinement utilizing NIL process simulation

Sachiko Kobayashi, Motofumi Komori, Inanami Ryoichi, Kyoji Yamashita, Akiko Mimotogi, Ji-Young Im, Masayuki Hatano, Takuya Kono, Shimon Maeda

Proceedings Volume 9777, 977708 (2016) https://doi.org/10.1117/12.2219052

KEYWORDS: Nanoimprint lithography, Lithography, Design for manufacturing, Photoresist processing, Computer simulations, Computational lithography, Design for manufacturability, Nanolithography, Optical lithography, Ultraviolet radiation, Double patterning technology, Calibration, Semiconductors, Optics manufacturing

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Proceedings Article | 28 March 2014 Paper

Challenges for pattern formation with sub-100nm residual-layer thickness by roll-to-roll nanoimprint lithography

Ryoichi Inanami, Kazuto Matsuki, Tomoko Ojima, Takuya Kono, Tetsuro Nakasugi

Proceedings Volume 9049, 90490I (2014) https://doi.org/10.1117/12.2046248

KEYWORDS: Nanoimprint lithography, Ultraviolet radiation, Positron emission tomography, Coating, Diffractive optical elements, Electrodes, Lithography, Semiconductors, Photography, Silicon films

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Proceedings Article | 12 April 2013 Paper

Solutions with precise prediction for thermal aberration error in low-k1 immersion lithography

Kazuya Fukuhara, Akiko Mimotogi, Takuya Kono, Hajime Aoyama, Taro Ogata, Naonori Kita, Tomoyuki Matsuyama

Proceedings Volume 8683, 86830U (2013) https://doi.org/10.1117/12.2011691

KEYWORDS: Photomasks, Diffraction, Lithographic illumination, Ions, Neodymium, Semiconductors, Critical dimension metrology, Immersion lithography, Control systems, Lithography

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Proceedings Article | 21 March 2012 Paper

Sub-100 nm pattern formation by roll-to-roll nanoimprint

Ryoichi Inanami, Tomoko Ojima, Kazuto Matsuki, Takuya Kono, Tetsuro Nakasugi

Proceedings Volume 8323, 83231J (2012) https://doi.org/10.1117/12.916584

KEYWORDS: Optical lithography, Nickel, Silicon, Semiconducting wafers, Positron emission tomography, Atomic force microscopy, Scanning electron microscopy, Ultraviolet radiation, Nanoimprint lithography, Lithography

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Proceedings Article | 23 March 2009 Paper

Polar Correction: new overlay control method for higher-order intra-field error dependent on the wafer coordinates

Manabu Takakuwa, Keigo Toriumi, Nobuhiro Komine, Kazutaka Ishigo, Takuya Kono, Tetsuro Nakasugi, Tatsuhiko Higashiki

Proceedings Volume 7272, 72720J (2009) https://doi.org/10.1117/12.813490

KEYWORDS: Semiconducting wafers, Overlay metrology, Data corrections, Immersion lithography, Process control, Control systems, Source mask optimization, Distortion, Osmium, Radon

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Proceedings Article | 16 March 2009 Paper

Feasibility of ultra-low k1 lithography for 28nm CMOS node

Shoji Mimotogi, Kazuhiro Takahata, Takashi Murakami, Seiji Nagahara, Kazuhiro Takeda, Masaki Satake, Yosuke Kitamura, Tomoko Ojima, Hiroharu Fujise, Yuriko Seino, Tatsuhiko Ema, Hiroki Yonemitsu, Manabu Takakuwa, Shinichiro Nakagawa, Takuya Kono, Masafumi Asano, Suigen Kyoh, Hideaki Harakawa, Akiko Nomachi, Tatsuya Ishida, Shunsuke Hasegawa, Katsura Miyashita, Makoto Tominaga, Soichi Inoue

Proceedings Volume 7274, 72741F (2009) https://doi.org/10.1117/12.814040

KEYWORDS: Lithography, Photomasks, Lithographic illumination, Binary data, Scanners, SRAF, Logic devices, Optical lithography, Metals, Semiconductors

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Proceedings Article | 4 December 2008 Paper

Patterning performance of hyper NA immersion lithography for 32nm node logic process

Kazuhiro Takahata, Masanari Kajiwara, Yosuke Kitamura, Tomoko Ojima, Masaki Satake, Hiroharu Fujise, Yuriko Seino, Tatsuhiko Ema, Manabu Takakuwa, Shinichiro Nakagawa, Takuya Kono, Masafumi Asano, Suigen Kyo, Akiko Nomachi, Hideaki Harakawa, Tatsuya Ishida, Shunsuke Hasegawa, Katsura Miyashita, Takashi Murakami, Seiji Nagahara, Kazuhiro Takeda, Shoji Mimotogi, Soichi Inoue

Proceedings Volume 7140, 714017 (2008) https://doi.org/10.1117/12.804739

KEYWORDS: Resolution enhancement technologies, Optical lithography, Logic, Lithography, SRAF, Metals, Immersion lithography, Semiconductors, Optical proximity correction, Logic devices

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Proceedings Article | 19 May 2008 Paper

Impact of patterning strategy on mask fabrication beyond 32nm

Shoji Mimotogi, Tomotaka Higaki, Hideki Kanai, Satoshi Tanaka, Masaki Satake, Yosuke Kitamura, Katsuyoshi Kodera, Kazutaka Ishigo, Takuya Kono, Masafumi Asano, Kazuhiro Takahata, Soichi Inoue

Proceedings Volume 7028, 702814 (2008) https://doi.org/10.1117/12.793045

KEYWORDS: Optical lithography, Photomasks, Double patterning technology, Critical dimension metrology, Lithography, Mask making, Logic devices, Optical alignment, Reactive ion etching, Semiconducting wafers

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Proceedings Article | 1 April 2008 Paper

Patterning strategy and performance of 1.3NA tool for 32nm node lithography

Shoji Mimotogi, Masaki Satake, Yosuke Kitamura, Kazuhiro Takahata, Katsuyoshi Kodera, Hiroharu Fujise, Tatsuhiko Ema, Koutaro Sho, Kazutaka Ishigo, Takuya Kono, Masafumi Asano, Kenji Yoshida, Hideki Kanai, Suigen Kyoh, Hideaki Harakawa, Akiko Nomachi, Tatsuya Ishida, Katsura Miyashita, Soichi Inoue

Proceedings Volume 6924, 69240M (2008) https://doi.org/10.1117/12.772201

KEYWORDS: Lithography, Optical lithography, Scanners, SRAF, Semiconducting wafers, Lithographic illumination, Metals, Photomasks, Semiconductors, Logic devices

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Proceedings Article | 14 May 2007 Paper

Virtual lithography system to improve the productivity of high-mix low-volume production

Kenji Yoshida, Takashi Sato, Takuya Kono, Eiji Yamanaka, Mitsuyo Kariya, Arata Inoue, Shoji Mimotogi

Proceedings Volume 6607, 66071J (2007) https://doi.org/10.1117/12.728966

KEYWORDS: Photomasks, Lithography, Semiconducting wafers, Critical dimension metrology, Data modeling, Manufacturing, Calibration, Reliability, Optical lithography, Virtual reality

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Proceedings Article | 26 March 2007 Paper

Integration of a new alignment sensor for advanced technology nodes

Paul Hinnen, Jerome Depre, Shinichi Tanaka, Ser-Yong Lim, Omar Brioso, Mir Shahrjerdy, Kazutaka Ishigo, Takuya Kono, Tatsuhiko Higashiki

Proceedings Volume 6520, 652023 (2007) https://doi.org/10.1117/12.712084

KEYWORDS: Optical alignment, Semiconducting wafers, Sensors, Overlay metrology, Manufacturing, Signal processing, Calibration, Lithography, Infrared sensors, Algorithm development

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In this paper alignment and overlay results of the advanced technology nodes are presented. These results were obtained on specially generated wafers as well as on regular manufacturing-type wafers. For this purpose, a new alignment sensor was integrated and evaluated in three generations of lithography tools, placed in R&D and mass manufacturing facilities. The capability of the sensor to align on marks with varying layout was evaluated. Long term overlay stability less than 11 nm was obtained on two different mark types: a standard ASML calibration mark and a flexible Toshiba mark design. The ability to align on low-contrast marks was validated by a dedicated experiment: typical alignment repeatability values of ~1 nm (3sigma) on shallow etch depth mark features of 25 nm are obtained for various mark designs, including flexible pitch alignment marks. From these results, design directions for improved mark detect ability were defined. The jointly developed mark designs were validated for their alignment robustness by an evaluation of manufacturing wafer alignment performance. On-product overlay results on manufacturing wafers were measured for three different process layers of the current technology node. The used alignment strategies were based on new mark capture and fine wafer alignment mark designs, thereby making optimal use of the mark design flexibility potential of the alignment sensor. Typical on-product overlay values obtained were less than 17 nm for the Active Area process layer, less than 12 nm for the Gate Conductor process layer, and less than 19 nm for the Metal-1 process layer; after applying batch corrections, as determined on a set of 2 send-ahead wafers. All results are based on full batch readout on an offline metrology tool. By applying optimal batch process corrections for linear terms, typical overlay values range between 10-14 nm, depending on the layer measured. Finally the sensor's infrared wavelengths were used to demonstrate a robust alignment solution for wafers containing a semi-transparent hard-mask layer.

Proceedings Article | 20 March 2006 Paper

Basic studies of overlay performance on immersion lithography tool

Ken-ichi Shiraishi, Tomoharu Fujiwara, Hirokazu Tanizaki, Yuuki Ishii, Takuya Kono, Shinichiro Nakagawa, Tatsuhiko Higashiki

Proceedings Volume 6154, 61540Q (2006) https://doi.org/10.1117/12.656306

KEYWORDS: Semiconducting wafers, Resonance energy transfer, Temperature metrology, Optical alignment, Overlay metrology, Immersion lithography, Photoresist developing, Photoresist materials, Scanners, Humidity

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SPIE Journal Paper | 1 April 2005

Alignment mark signal simulation system for the optimum mark feature selection

Takashi Sato, Ayako Endo, Tatsuhiko Higashiki, Kazutaka Ishigo, Takuya Kono, Takashi Sakamoto, Yoshiyuki Shioyama, Satoshi Tanaka

JM3, Vol. 4, Issue 02, 023002, (April 2005) https://doi.org/10.1117/12.10.1117/1.1898603

KEYWORDS: Signal processing, Semiconducting wafers, Optical alignment, TCAD, Photomasks, Metals, Computer aided design, Laser ablation, Chemical mechanical planarization, Inspection

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Proceedings Article | 24 May 2004 Paper

Alignment mark signal simulation system for the optimum mark feature selection

Takashi Sato, Ayako Endo, Tatsuhiko Higashiki, Kazutaka Ishigo, Takuya Kono, Takashi Sakamoto, Yoshiyuki Shioyama, Satoshi Tanaka

Proceedings Volume 5375, (2004) https://doi.org/10.1117/12.532808

KEYWORDS: Signal processing, Optical alignment, TCAD, Semiconducting wafers, Photomasks, Computer aided design, Metals, Optical simulations, Inspection, Chemical mechanical planarization

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Proceedings Article | 29 April 2004 Paper

Mix-and-match overlay method by compensating dynamic scan distortion error

Takuya Kono, Manabu Takakuwa, Keita Asanuma, Nobuhiro Komine, Tatsuhiko Higashiki

Proceedings Volume 5378, (2004) https://doi.org/10.1117/12.535097

KEYWORDS: Distortion, Scanners, Overlay metrology, Data modeling, Control systems, Error analysis, Databases, Semiconducting wafers, Systems modeling, Semiconductors

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Showing 5 of 32 publications

Conference Committee Involvement (1)

Novel Patterning Technologies 2025

23 February 2025 | San Jose, California, United States

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